Class A – Through-hole mounted components only
Class B – Surface Mount components only
Class C – Simplistic through-hole and surface mount intermixed assembly
Class X – Complex intermixed assembly (Through-hole, surface mount, fine pitch and BGA)
Class Y – Complex intermixed assembly (Through-hole, surface mount, ultrafine pitch and chip scale)
Class Z – Complex intermixed assembly (Through-hole, ultrafine pitch, COB, flip-chip and TAB)
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